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| Package information - DIL14 Dual in-line, 14 pin package Package outline E1 b2 D1 b3 D A2 A1 L b2 b DIM A A1 A2 b b2 b3 c D E A eA e eC eB DIM D1 E E1 e eA eB eC L c Inches Min Max 0.210 0.015 0.115 0.195 0.014 0.022 0.045 0.070 N/A N/A 0.008 0.014 0.735 0.775 Millimeters Min Max 5.33 0.38 2.92 4.95 0.36 0.56 1.14 1.78 N/A N/A 0.20 0.36 18.67 19.69 Inches Min Max 0.005 0.300 0.325 0.240 0.280 0.100 BSC 0.300 BSC 0.430 0.000 0.060 0.115 0.150 Millimeters Min Max 0.13 7.62 8.26 6.10 7.11 2.54 BSC 7.62 BSC 10.92 0.00 1.52 2.92 3.81 Note: Controlling dimensions are in inches. Approximate dimensions are provided in millimeters Taping specification Dual inline devices (DIL8, DIL14, DIL16 and DIL20) are provided in tubes. Issue 1 - September 2005 (c) Zetex Semiconductors plc 2005 1 www.zetex.com Package information - DIL14 This publication is issued to provide outline information only which (unless agreed by the company in writing) may not be used, applied or reproduced for any purpose or form part of any order or contact or be regarded as a representation relating to the products or services concerned. The company reserves the right to alter without notice the specification, design, price or conditions of supply of any product or service. Issue 1 - September 2005 (c) Zetex Semiconductors plc 2005 2 www.zetex.com |
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